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Dopant Selective Deep Reactive Ion Etching of 4H-SiC Wafer

Special Notice monitored from sam-gov.

Buyer / agency
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Notice type
Special Notice
Solicitation number
80NSSC27946811Q
Posted
October 13, 2026
Response deadline
October 16, 2026
Location
OH, US
Estimated value
Not published by the source
NAICS
334413
Source
sam-gov

Summary

NASA/NSSC has a requirement for Dopant Selective Deep Reactive Ion Etching of 4H-SiC Wafer. See attached SOW for full details of the requirement. VENDORS MUST REFERENCE THE NOTICE ID WHEN SUBMITTING A CAPABILITY STATEMENT. NOTE: Quotes received in response to this notice will NOT be considered and will not be evaluated by NASA�s Technical End User Team. We are currently only requesting Capability Statements.

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Summaries are indexed from official public sources; the issuing platform’s notice, documents, and amendments always control.