OCTOBIDPublic Tender GazetteSecure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies
Special Notice monitored from sam-gov.
- Buyer / agency
- DEPT OF DEFENSE
- Notice type
- Special Notice
- Solicitation number
- W52P1J26R0001
- Posted
- August 18, 2026
- Response deadline
- September 16, 2026
- Location
- US
- Estimated value
- Not published by the source
- NAICS
- 541715
- Source
- sam-gov
Summary
Information Requested: The U.S. Army Combat Capabilities Development Command Aviation and Missile Center (DEVCOM AvMC), Redstone Arsenal, AL is conducting market research to identify domestic products, suppliers, designers and manufacturers of advanced protection architectures, systems, components, and other technologies for packaged microelectronics intended for deployment into current and future military systems of interest to the Department of Defense (DoD). This RFI is se…
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Summaries are indexed from official public sources; the issuing platform’s notice, documents, and amendments always control.